TechBlog

Fly-by-Wireless

Every ounce of weight brought to the lunar surface costs 40 to 60 times that in fuel needed at liftoff from the Earth. Part of that weight penalty is due to wires, but the cost of wires is much more than weight. Wired connectivity drives up the price of design from the beginning: it drives the cost of the many systems and structures; it drives inspection, troubleshooting, maintenance, and upgrade costs; as well as the cost of making system changes. Future vehicles that can reduce the effects and limitations of wires will not be without risk or a lot of work, but the effort has begun.

Continue reading ‘Fly-by-Wireless: A Less-Wire and Wireless Revolution for Aerospace Vehicle Architectures’ »

True wafer-level packaging could dramatically reduce the cost of M(O)EMS manufacturing. MOEMS packages require optical transparency at the operating wavelength of the individual sensors and actuators, in addition to the conventional packaging requirements of MEMS.

Herwig Kirchberger, EV Group, St. Florian, Austria — Semiconductor International, 4/1/2008

Packaging costs of microelectromechanical systems (MEMS) still account for more than 50% of the total cost of most of these devices. Aligned wafer bonding techniques for wafer-level packaging (WLP), however, have the potential to reduce these costs, thanks to a smaller-sized total package, improved performance and shorter time to market. Continue reading ‘WLP Could Transform MOEMS, MEMS’ »

RF Micro Devices, Inc. (RFMD) recently announced that effective immediately RFMD is reducing its investments in wireless systems, including cellular transceivers and GPS solutions, in order to focus on core semiconductor component opportunities, including cellular front ends and other components in RFMD’s Cellular Products Group (CPG) and the expanding portfolio of semiconductor components in RFMD’s Multi-Market Products Group (MPG).

As a result, RFMD currently expects to eliminate product development expenses related to its wireless systems business by approximately $75 million this fiscal year beginning in the June 2008 quarter, with the full benefit expected to be realized in the December 2008 quarter.

Bob Bruggeworth, president and CEO of RFMD, said, “These strategic actions will enable RFMD to deliver more predictable financial results and substantially higher profitability. We are the industry leader in RF components and the world’s largest manufacturer of compound semiconductors. We are investing in growing markets where we have a demonstrated track record of success, and we will measure our progress using operating income and return on invested capital (ROIC) as key performance metrics. We anticipate steady financial improvement throughout the year, and we currently forecast at least 10% non-GAAP operating income and double-digit ROIC by the end of the calendar year.

Continue reading ‘RFMD To Eliminate Approximately $75 Million In Wireless Systems Expenses’ »

OASIS Spectrum Monitoring & Interference Analysis Software shifts the focus from how to gather and interpret the data to a focus on solving spectrum management issues. It provides more complete and useable information than available from switch metrics. OASIS transforms the spectrum analyzer or any other RF receiver from an analytical instrument, displaying single sweeps of power vs. frequency to a comprehensive spectrum management tool. And with its unattended operation feature, OASIS captures and characterizes transient events without keeping an engineer or technician in the field.

OASIS is an affordable spectrum monitoring software application that provides a variety of tools and utilities beneficial to:

• Maintaining a high quality of service in wireless networks
• Surveying the RF environment for undesired, unauthorized transmissions or threats
• Locating the source of interfering signals
• Recording a history of the RF environment for subsequent replay and analysis
• Identifying changes in the RF environment

Continue reading ‘OASIS Spectrum Monitoring & Interference Analysis Software’ »

Applied scientists at Harvard University in collaboration with researchers from the German universities of Jena, Gottingen, and Bremen, have developed a new technique for fabricating nanowire photonic and electronic integrated circuits that may one day be suitable for high-volume commercial production.

Spearheaded by graduate student Mariano Zimmler and Federico Capasso, Robert L. Wallace Professor of Applied Physics and Vinton Hayes Senior Research Fellow in Electrical Engineering, both of Harvard’s School of Engineering and Applied Sciences (SEAS), and Prof. Carsten Ronning of the University of Jena, the findings will be published in Nano Letters. The researchers have filed for U.S. patents covering their invention.

While semiconductor nanowires—rods with an approximate diameter of one-thousandth the width of a human hair—can be easily synthesized in large quantities using inexpensive chemical methods, reliable and controlled strategies for assembling them into functional circuits have posed a major challenge. By incorporating spin-on glass technology, used in Silicon integrated circuits manufacturing, and photolithography, transferring a circuit pattern onto a substrate with light, the team demonstrated a reproducible, high-volume, and low-cost fabrication method for integrating nanowire devices directly onto silicon.

Continue reading ‘Method For Integrating Nanowire Devices Directly Onto Silicon Developed’ »

In the wake of personal navigation devices’ success, cellular carriers have started to offer on-board and off-board navigation solutions, as well as a range of LBS (Location Based Services) such as friend finder and local search on GPS handsets. Community and social-networking-related functionality, such as the sharing of POIs (Points of Interest) and geo-tagged pictures, is also becoming popular and is expected to boost GPS-enabled handset uptake as carriers, handsets manufacturers, and service providers look to capitalize on the LBS trend.

“While most CDMA handsets are already GPS-enabled and GPS is set to become a standard feature in GSM smartphones, GSM feature phones are next on the agenda to be equipped with GPS technology,” says ABI Research principal analyst Dominique Bonte. “GPS chipset vendors increasingly target handsets, looking for new markets and spurred on by the recent dramatic growth of personal navigation devices.”

However, as GPS begins to penetrate lower-end phones, the cost, power consumption, and footprint of GPS chipsets will have to be further reduced. This will be made possible by single chipset technology and the emergence in 2009 of combination chips integrating GPS, Bluetooth, and Wi-Fi all on one die. Major silicon vendors such as Broadcom, NXP, and Atheros are well positioned to develop such solutions following the acquisition of GPS chipset vendors Global Locate, GloNav, and u-Nav, respectively.

Continue reading ‘More Than 550 Million GPS-Enabled Handsets Will Ship By 2012’ »

From Tesla and Marconi’s electric coils and arcs to the youngster’s model car that speeds or stops at the nudge of the controls, we’ve had a fascination with wireless control and communication.

And with the explosion over the last 25 years of wireless from cell phones to Internet, interest in industrial uses has grown. This could easily afflict anyone from refinery or public works managers to manufacturing techs with equipment monitoring and control needs.

Regardless of the potential, early attempts to adapt wireless technology to industrial applications met with limited success.

Continue reading ‘Industrial Wireless Modems Come of Age’ »