2nd June 2008, 07:11 pm
Three-dimensional (3D) packaging is expected to emerge as a dominant performing solution in the electronic/chip packaging industry, says a new study from Frost & Sullivan. The analysis, “Global Trends in Electronic/Chip Packaging,” finds that 3D packaging technology will be key in catering to the ever-increasing miniaturization demands from application sectors that include consumer electronics and a wide range of high-speed memory devices.
Looking beyond successful solutions such as system on chip (SoC), the electronic/chip packaging industry has steadily started exploring various forms of system in package (SiP)-based solutions.
Continue reading ‘3D packaging technologies evolve in response to miniaturization’ »
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3D,
chip,
curve,
Electronic/Chip,
Global,
In,
Level,
miniaturization,
Moore,
on,
package,
packaging,
SiP,
SoC,
System,
Three-dimensional,
Trends,
wafer,
WLP Category:
Electronic Devices,
Physics |
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19th February 2008, 04:43 am
HEXADECIMAL DISPLAY
Features
- Separate LED and Logic Power Supplies May Be Used.
- Internal TTL MSI Chip With Latch, Decoder, and Driver.
- Constant-Current Drive for Hexadecimal Characters.
- Operates from 5-V Supply.
- RoHS Compliant.
Description
Continue reading ‘LED HEXADECIMAL DISPLAY, LED DISPLAY TIL311’ »
Tags:
4 × 7,
chip,
Decoder,
Driver,
Latch,
LED,
light-emitting-diode,
MSI,
TTL Category:
Computer Technology,
Consumer Electronics & Entertainment,
Display Technology,
Electronic Devices,
Optics |
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4th February 2008, 05:22 pm
Product Name:
nRF24E2 Transmitter / MCU / ADCProduct Description:
Introducing the nRF24E2 transmitter with embedded 8051 MCU, 9 channel 12-bit ADC, and peripherals — the industry’s most complete wireless 2.4GHz ISM band platform
Continue reading ‘Nordic Semiconductor nRF24E2’ »
Tags:
12-bit,
8051,
9-channel,
ADC,
band,
chip,
Embedded,
IC's,
ISM,
MCU,
nRF24E2,
on,
Platform,
SoC,
System,
transmitter,
wireless 2.4GHz Category:
Automation,
Communication,
Computer Technology,
Consumer Electronics & Entertainment,
Control Engineering,
Electronic Devices,
Mechatronics,
Microcontroller,
Software Issues,
Tech-News |
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4th February 2008, 02:48 pm
“Rarely is Wi-Fi invoked within the context of wireless sensor networking or industrial process control,” observes Sam Lucero, ABI Research senior analyst. “Wi-Fi is considered too power-intensive as many sensors, actuators, and other devices require battery operation while deployed for several years at a time – whereas Wi-Fi is optimized for limited time usage: from a few hours to less than a full day.”
But a new transition peeks over the horizon, put forth by a company called GainSpan.
A Wi-Fi chipset company, GainSpan has developed various techniques that provide the battery life needed by sensor networks for Wi-Fi.
Continue reading ‘Wi-Fi Moves Into The Sensor Networking Realm’ »
Tags:
ABI,
chip,
control,
GainSpan,
industrial,
networking,
on,
Process,
Research,
Sam Lucero,
sensor,
SoC,
System,
Wi-Fi,
wireless Category:
Automation,
Communication,
Computer Technology,
Consumer Electronics & Entertainment,
Control Engineering,
Electronic Devices,
Mechatronics,
Microcontroller,
Physics,
Sensors |
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14th January 2008, 02:50 pm
Multiple graphics solutions seem to be the latest buzzword in the industry; if a third party isn’t hashing together an ATI x1950 with two GPU chips on board then nVidia is bolting two 7950s to each other and selling them for use in Quad SLI setups - albeit sans the needed driver support. The latest iterations of this concept include the recently leaked nVidia 9800 GX2 and the now-spotted-at-CES AMD Radeon HD 3870 X2.
Continue reading ‘CES 2008: AMD Radeon HD 3870 X2 Spotted’ »
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3870,
9800,
AMD,
ATI,
CES,
CES 2008,
chip,
clock,
cores,
GPU,
GRRD,
GX2,
HD,
interfaces,
nvidia,
PCB,
processor,
Radeon,
RAM,
speed,
X2 Category:
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