Posts tagged ‘microscope’

Closest Look Ever At Graphene

Closest Look Ever At Graphene

Hailed as the world’s most powerful transmission electron microscope, TEAM 0.5 is living up to expectations. Using TEAM 0.5 (TEAM stands for Transmission Electron Aberration-corrected Microscope), researchers with the U.S. Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab) have produced stunning images of individual carbon atoms in graphene, the two-dimensional crystalline form of carbon that is highly prized by the electronics industry. These first time ever images were recorded at Berkeley Lab’s National Center for Electron Microscopy (NCEM), a DOE national user facility that is a premier center for electron microscopy and microcharacterization. TEAM 0.5, its newest instrument, is capable of producing images with half-angstrom resolution, which is less than the diameter of a single hydrogen atom. “Simply put, TEAM 0.5 is the best transmission electron microscope in the world, representing a quantum leap forward in instrumentation,” said physicist Alex Zettl who led this research. “Having the ability to see, basically in real time, each and every individual atom in a sample is unbelievably useful and the images we can now see have been jaw-dropping for even the most seasoned electron microscopists. TEAM 0.5 is pushing transmission electron microscopy to a new level.” Zettl holds joint appointments with Berkeley Lab’s Materials Sciences Division (MSD) and the Physics Department at the University of California’s Berkeley campus, where he is the director of the Center of Integrated Nanomechanical Systems. Collaborating with him on this graphene imaging project were Jannik Meyer, also with Berkeley Lab’s Materials Sciences Division, and Christian Kisielowski, Rolf Erni and Marta Rossell of NCEM. Their results were published in the journal Nanoletters, in a paper entitled: “Direct imaging of lattice atoms and topological defects in graphene membranes.” The properties of solid materials stem from the arrangement of their constituent atoms in the solid’s crystal structure. While technologies such as electron and x-ray crystallography can reveal the atomic geometry of a crystal, they do not identify the precise location and position of each individual atom. When the dimensions of a material shrink to the nanoscale, the location and position of each individual atom becomes critically important, as Zettl explains. “Think of the steel re-bars on a three-dimensional structure, like a jungle gym,” he said. “If a small piece of re-bar is rusted out somewhere in the center of the gym, it won’t likely have much affect on the overall properties of the structure. In a two-dimensional structure, however, a rusted out segment becomes a much bigger problem, and in a one-dimensional structure, i.e., a single re-bar, a rusted out segment can be catastrophic, causing the entire structure to fail.

On a nanoscale crystal, one missing atom or some other defect in the arrangement can result in catastrophic failure.” Graphene is especially sensitive to defects in its atomic structure. Consisting of a single-layered sheet of carbon atoms arranged in hexagons, like a sheet of chicken wire with an atom at each nexus, graphene features extraordinary electrical, mechanical and thermal properties that could enable it to serve in a broad array of carbon-based electronic devices. For the enormous promises of graphene to be fulfilled, however, scientists need a much better understanding of how specific types of defects in the crystal structure, including those that change location over time, affect its properties.

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Veeco Introduces New InSight 3D Atomic Force Microscope

Woodbury, NY — Veeco Instruments Inc., announced the introduction of its new InSight 3D Automated Atomic Force Microscope (AFM) Platform, the only metrology system available with the accuracy and precision required for non-destructive, high resolution three-dimensional (3D) measurements of critical 45nm and 32nm semiconductor features, with the speed to qualify as a true fab tool. Veeco’s InSight 3DAFM was designed specifically to address Critical Dimension (CD), depth and chemical mechanical planarization (CMP) metrology in a production environment.John R. Peeler, Chief Executive Officer of Veeco, commented, “With three times the throughput (30 wafers per hour) and two times the measurement accuracy and precision of our previous AFMs, Veeco’s InSight represents an entirely new approach for semiconductor 3D metrology. It is the only tool on the market today providing in-line, accurate, non-destructive 3D information, to drive shorter process development and manufacturing ramp times, improve our customers’ cost of ownership and decrease their manufacturing risk.”

“At 45nm and below, current in-line metrology techniques are limited in their ability to measure CD,” added Paul Clayton, Vice President, Veeco’s Auto AFM Business Unit. “Technologies such as CD-SEM and scatterometry are precise, but not accurate enough, causing significant measurement issues. Veeco’s InSight provides the lowest measurement uncertainty for CD metrology, which leads to improved process control.”

About InSight 3DAFM
The InSight 3DAFM features a completely new metrology platform designed to meet the stringent requirements of 45 and 32nm semiconductor metrology applications such as CD, sidewall angle and line width roughness on critical layers such as Gate and FinFet structures. The system contains a new high-precision X-Y stage with improved accuracy and a new pattern recognition system with high-precision laser auto-focus capability. In addition, new AFM control techniques and new probe designs enable improved precision, lower cost per measurement site and smaller feature measurement. Finally, system reliability is significantly enhanced to meet the demands of 45nm production-based metrology.

Smaller Is Stronger — Now Scientists Know Why

Berkeley, CA — As structures made of metal get smaller — as their dimensions approach the micrometer scale (millionths of a meter) or less — they get stronger. Scientists discovered this phenomenon 50 years ago while measuring the strength of tin “whiskers” a few micrometers in diameter and a few millimeters in length. Many theories have been proposed to explain why smaller is stronger, but only recently has it become possible to see and record what’s actually happening in tiny structures under stress.Andrew Minor, of the Materials Sciences Division in the Department of Energy’s Lawrence Berkeley National Laboratory, with colleagues from Hysitron Incorporated and the General Motors Research and Development Center, used the In Situ Microscope at the National Center for Electron Microscopy (NCEM) to record what happens when pillars of nickel with diameters between 150 and 400 nanometers (billionths of a meter) are compressed under a flat punch made of diamond. The transmission electron microscope is equipped so that samples can be stressed, measured, and videotaped while being observed under the electron beam.

“What controls the deformation of a metal object is the way that defects, called dislocations, move along planes in its crystal structure,” Minor says. “The result of dislocation slip is plastic deformation. For example, bending a paper clip causes its trillions of dislocations per square centimeter to tangle up and multiply as they run into one another and slide along numerous slip planes.”

In general, mechanical deformation tends to increase the number of dislocations in a material. But for small-scale structures, with a much greater proportion of surface area to volume, the process can be very different. The videotaped images from the electron microscope helped the researchers understand why nanoscale nickel pillars are so strong by allowing them to observe changes in the microstructure of the pillars during deformation — including a never-before-seen process the researchers dubbed “mechanical annealing.” (In bulk materials, annealing, a treatment that reduces the density of defects, is usually accomplished by heating.)

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Nanowire battery can hold 10 times the charge of existing lithium-ion battery

Nature Nanotechnology

Photos taken by a scanning electron microscope of silicon nanowires before (left) and after (right) absorbing lithium. Both photos were taken at the same magnification. The work is described in “High-performance lithium battery anodes using silicon nanowires,” published online Dec. 16 in Nature Nanotechnology.

silicon nanowires

Stanford researchers have found a way to use silicon nanowires to reinvent the rechargeable lithium-ion batteries that power laptops, iPods, video cameras, cell phones, and countless other devices.

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