TechBlog

Non Destructive Testing 

Non-destructive testing is a descriptive term used for the examination of materials and components to determine surface and subsurface defects in a way that allows such materials to be examined without changing or destroying their original design or structure.

NDT plays a crucial role in everyday life and is necessary to assure safety and reliability. Typical examples are found in aircraft, motor vehicles, pipelines, vessels, bridges, trains, power stations, refineries and oil platforms which are all inspected using NDT.

NDT is also a quality assurance production and management tool which can give impressive results when used correctly. It requires an understanding of the various methods available, their capabilities and limitations, knowledge of the relevant standards and specifications for performing the tests.

Continue reading ‘What is NDT ?’ »

Woodbury, NY — Veeco Instruments Inc., announced the introduction of its new InSight 3D Automated Atomic Force Microscope (AFM) Platform, the only metrology system available with the accuracy and precision required for non-destructive, high resolution three-dimensional (3D) measurements of critical 45nm and 32nm semiconductor features, with the speed to qualify as a true fab tool. Veeco’s InSight 3DAFM was designed specifically to address Critical Dimension (CD), depth and chemical mechanical planarization (CMP) metrology in a production environment.John R. Peeler, Chief Executive Officer of Veeco, commented, “With three times the throughput (30 wafers per hour) and two times the measurement accuracy and precision of our previous AFMs, Veeco’s InSight represents an entirely new approach for semiconductor 3D metrology. It is the only tool on the market today providing in-line, accurate, non-destructive 3D information, to drive shorter process development and manufacturing ramp times, improve our customers’ cost of ownership and decrease their manufacturing risk.”

“At 45nm and below, current in-line metrology techniques are limited in their ability to measure CD,” added Paul Clayton, Vice President, Veeco’s Auto AFM Business Unit. “Technologies such as CD-SEM and scatterometry are precise, but not accurate enough, causing significant measurement issues. Veeco’s InSight provides the lowest measurement uncertainty for CD metrology, which leads to improved process control.”

About InSight 3DAFM
The InSight 3DAFM features a completely new metrology platform designed to meet the stringent requirements of 45 and 32nm semiconductor metrology applications such as CD, sidewall angle and line width roughness on critical layers such as Gate and FinFet structures. The system contains a new high-precision X-Y stage with improved accuracy and a new pattern recognition system with high-precision laser auto-focus capability. In addition, new AFM control techniques and new probe designs enable improved precision, lower cost per measurement site and smaller feature measurement. Finally, system reliability is significantly enhanced to meet the demands of 45nm production-based metrology.