Posts tagged ‘on’

3D packaging technologies evolve in response to miniaturization

Three-dimensional (3D) packaging is expected to emerge as a dominant performing solution in the electronic/chip packaging industry, says a new study from Frost & Sullivan. The analysis, “Global Trends in Electronic/Chip Packaging,” finds that 3D packaging technology will be key in catering to the ever-increasing miniaturization demands from application sectors that include consumer electronics and a wide range of high-speed memory devices.

Looking beyond successful solutions such as system on chip (SoC), the electronic/chip packaging industry has steadily started exploring various forms of system in package (SiP)-based solutions.

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Salt on Mars? ASU helps scientists make discovery

In Arizona State University camera orbiting Mars has uncovered salt deposits on the cratered Martian surface, suggesting water was once widespread on the Red Planet.

Scientists say the more than 200 deposits likely formed through water evaporation and could be ideal places to look for past life because of salt’s preservative qualities.

The findings are being published Friday in Science magazine.

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Speciality Glass

Glass materials have a random, liquid-like (non-crystalline) molecular structure. They are heated to a temperature sufficient to produce a completely fused melt. Raw materials for glass include cullet (crushed, recycled glass), sand, soda ash, limestone, and additives. At ordinary temperatures, glass materials are relatively strong, inert, biologically inactive, and corrosion resistant. They also provide excellent thermal and electrical insulation, and are characterized by high dielectric strength. During the fabrication of glass materials, the properties of glass can be modified as necessary by additives or heat treatment. Glass materials include embedded glass, tempered glass, borosilicate glass, and soda lime glass. Embedded glass refers to glass materials that are embedded with wire for resistance heating or reinforcement. Tempered glass provides increased strength and can shatter into small pieces when broken. Borosilicate glass offers superior durability, chemical resistance, and heat resistance. These properties make borosilicate glass suitable for use in chemical processes, in the pharmaceutical industry, in high-powered lamps, and in cookware and other heat-resistant products. Soda lime glass is used in everyday products such as bottles, jars, drinking glasses, and window glass.

Lead glass, electronic glass, opal glass, and fused silica glass are types of glass materials. Lead glass (also called lead-alkali glass) has a high percentage of lead oxide (at least 20%) to increase its index of refraction. Lead glass is relatively soft, a better electrical insulator than soda-lime or borosilicate glass, and used for optical applications such as prisms and lenses. Electronic glass is used in fabricating electronic components such as X-ray tubes, display devices, and chip components. Opal glass is used to diffuse light uniformly. Fused silica glass has excellent resistance to thermal shock, withstands high operating temperatures (1,200° C for short periods), and is used in optical waveguides and crucibles for growing crystals.

Several organizations maintain standards for glass materials. ASTM International (formerly called the American Society for Testing and Materials (ASTM) Technical Committee C14 on Glass and Glass Products maintains several standards, including ASTM E708-79(1999) Standard Specification for Waste Glass as a Raw Material for the Manufacture of Glass Containers. The International Organization for Standardization (ISO) supports Technical Committees on glass materials, including TC 48 on quality of glassware and TC 160 on glass in building.

Corning Extends Fusion Process to Touch-Screen Applications

Scratch-resistant Gorilla glass provides an ultra-durable screen for handheld devices without compromising image quality.

At Corning Incorporated’s annual investor meeting in New York, the 800-pound gorilla in the room will be a thin and elegant sheet of glass tough enough to withstand daily use and abuse—without scratching. Developed for touch-screen applications and high-end portable devices, Corning’s Gorilla glass technology addresses the challenge of providing an ultra-durable screen for handheld devices without compromising image quality. The fusion-formed glass features a pristine surface that requires no polishing, reducing time and cost for customers.

Dr. Joseph A. Miller, Chief Technology Officer, will confirm during his investor update that Gorilla glass is now commercially available and is being sold to mobile-device manufacturers. Corning’s newest technology joins a growing platform of innovations addressing key challenges, shaping the future of portable displays: durability, longevity, and functionality.

Other recent technology developments addressing these challenges include: Continue reading ‘Corning Extends Fusion Process to Touch-Screen Applications’ »

Nordic Semiconductor nRF24E2

Product Name:
nRF24E2 Transmitter / MCU / ADC
Product Description:
Introducing the nRF24E2 transmitter with embedded 8051 MCU, 9 channel 12-bit ADC, and peripherals — the industry’s most complete wireless 2.4GHz ISM band platform

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Wi-Fi Moves Into The Sensor Networking Realm

Rarely is Wi-Fi invoked within the context of wireless sensor networking or industrial process control,” observes Sam Lucero, ABI Research senior analyst. “Wi-Fi is considered too power-intensive as many sensors, actuators, and other devices require battery operation while deployed for several years at a time – whereas Wi-Fi is optimized for limited time usage: from a few hours to less than a full day.”

But a new transition peeks over the horizon, put forth by a company called GainSpan.

A Wi-Fi chipset company, GainSpan has developed various techniques that provide the battery life needed by sensor networks for Wi-Fi.

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