2nd June 2008, 07:11 pm
Three-dimensional (3D) packaging is expected to emerge as a dominant performing solution in the electronic/chip packaging industry, says a new study from Frost & Sullivan. The analysis, “Global Trends in Electronic/Chip Packaging,” finds that 3D packaging technology will be key in catering to the ever-increasing miniaturization demands from application sectors that include consumer electronics and a wide range of high-speed memory devices.
Looking beyond successful solutions such as system on chip (SoC), the electronic/chip packaging industry has steadily started exploring various forms of system in package (SiP)-based solutions.
Continue reading ‘3D packaging technologies evolve in response to miniaturization’ »
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4th February 2008, 05:22 pm
Product Name:
nRF24E2 Transmitter / MCU / ADCProduct Description:
Introducing the nRF24E2 transmitter with embedded 8051 MCU, 9 channel 12-bit ADC, and peripherals — the industry’s most complete wireless 2.4GHz ISM band platform
Continue reading ‘Nordic Semiconductor nRF24E2’ »
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4th February 2008, 02:48 pm
“Rarely is Wi-Fi invoked within the context of wireless sensor networking or industrial process control,” observes Sam Lucero, ABI Research senior analyst. “Wi-Fi is considered too power-intensive as many sensors, actuators, and other devices require battery operation while deployed for several years at a time – whereas Wi-Fi is optimized for limited time usage: from a few hours to less than a full day.”
But a new transition peeks over the horizon, put forth by a company called GainSpan.
A Wi-Fi chipset company, GainSpan has developed various techniques that provide the battery life needed by sensor networks for Wi-Fi.
Continue reading ‘Wi-Fi Moves Into The Sensor Networking Realm’ »
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